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Electropolishing of WCu composite in a deep eutectic solvent

Anna Kityk, Miroslav Hnatko, Viliam Pavlik, and Miroslav Boča

Ukrainian State University of Chemical Technology, Dnipro, Ukraine

 

E-mail: kitykanna7@gmail.com

Received: 13 July 2020  Accepted: 9 November 2020

Abstract:

The possibility of using a deep eutectic mixture of choline chloride and ethylene glycol in a 1:2 molar ratio (ethaline) for the electropolishing of a WCu composite (~ 71 wt.% of W and ~ 12 wt.% of Cu) has been shown for the first time. It was demonstrated that 20 min electropolishing in ethaline at a temperature of 25 ºC causes significant leveling of the surfaces and decreases the amount of defects and the depth of scratches. It was also found that electropolishing of WCu composite in ethaline was accompanied by changes in the elemental surface composition: a decrease in Cu, C and O concentrations and an increase in W concentration were observed. It was shown that such changes in the surface elemental composition of WCu samples, together with the leveling of the surfaces and elimination of defects, led to almost a fourfold improvement in the corrosion resistance of the samples in 10 wt.% aqueous NaCl solution.

Keywords: WСu composite; Electropolishing; Deep eutectic solvent; Cyclic voltammogram; Corrosion resistance

Full paper is available at www.springerlink.com.

DOI: 10.1007/s11696-020-01426-5

 

Chemical Papers 75 (4) 1767–1771 (2021)

Tuesday, April 23, 2024

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